The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Kaedah analisis untuk menganggar gandingan antara garisan jalur mikro dalam arah sewenang-wenangnya pada lapisan bersebelahan dalam papan litar bercetak berbilang lapisan dikaji: satu garisan dibenamkan dan satu lagi berada pada lapisan permukaan. Gandingan atau crosstalk telah dianggarkan melalui pembangunan pendekatan konsep litar berdasarkan persamaan telegrafer yang diubah suai bagi pendekatan Agrawal dan bukannya pendekatan Taylor untuk beberapa kelebihan pengiraan. Medan elektromagnet dari garisan mikrojalur terbenam dan garis jalur mikro pada permukaan boleh didapati dengan menggunakan kaedah imej elektrik untuk substrat dielektrik. Untuk mengesahkan pendekatan yang dicadangkan, kami menjalankan beberapa eksperimen dan membandingkan keputusan pendekatan kami dengan pengukuran dan penyelesai elektromagnet komersial.
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Salinan
Sang-Wook PARK, Fengchao XIAO, Yoshio KAMI, "Crosstalk Analysis for Embedded-Line Structure at PCB Using Circuit-Concept Approach" in IEICE TRANSACTIONS on Communications,
vol. E92-B, no. 6, pp. 1945-1952, June 2009, doi: 10.1587/transcom.E92.B.1945.
Abstract: An analytical method for estimating coupling between microstrip lines in arbitrary directions on adjacent layers in multi-layer printed circuit boards is studied: one line is embedded and the other is on the surface layer. Coupling or crosstalk has been estimated by development of a circuit-concept approach based on modified telegrapher's equations of the Agrawal approach instead of the Taylor approach for some computational advantages. Electromagnetic fields from the embedded microstrip line and the microstrip line on the surface can be obtained by using the electric image method for dielectric substrates. To verify the proposed approach, we conducted some experiments and compared the results of our approach with those of measurement and a commercial electromagnetic solver.
URL: https://global.ieice.org/en_transactions/communications/10.1587/transcom.E92.B.1945/_p
Salinan
@ARTICLE{e92-b_6_1945,
author={Sang-Wook PARK, Fengchao XIAO, Yoshio KAMI, },
journal={IEICE TRANSACTIONS on Communications},
title={Crosstalk Analysis for Embedded-Line Structure at PCB Using Circuit-Concept Approach},
year={2009},
volume={E92-B},
number={6},
pages={1945-1952},
abstract={An analytical method for estimating coupling between microstrip lines in arbitrary directions on adjacent layers in multi-layer printed circuit boards is studied: one line is embedded and the other is on the surface layer. Coupling or crosstalk has been estimated by development of a circuit-concept approach based on modified telegrapher's equations of the Agrawal approach instead of the Taylor approach for some computational advantages. Electromagnetic fields from the embedded microstrip line and the microstrip line on the surface can be obtained by using the electric image method for dielectric substrates. To verify the proposed approach, we conducted some experiments and compared the results of our approach with those of measurement and a commercial electromagnetic solver.},
keywords={},
doi={10.1587/transcom.E92.B.1945},
ISSN={1745-1345},
month={June},}
Salinan
TY - JOUR
TI - Crosstalk Analysis for Embedded-Line Structure at PCB Using Circuit-Concept Approach
T2 - IEICE TRANSACTIONS on Communications
SP - 1945
EP - 1952
AU - Sang-Wook PARK
AU - Fengchao XIAO
AU - Yoshio KAMI
PY - 2009
DO - 10.1587/transcom.E92.B.1945
JO - IEICE TRANSACTIONS on Communications
SN - 1745-1345
VL - E92-B
IS - 6
JA - IEICE TRANSACTIONS on Communications
Y1 - June 2009
AB - An analytical method for estimating coupling between microstrip lines in arbitrary directions on adjacent layers in multi-layer printed circuit boards is studied: one line is embedded and the other is on the surface layer. Coupling or crosstalk has been estimated by development of a circuit-concept approach based on modified telegrapher's equations of the Agrawal approach instead of the Taylor approach for some computational advantages. Electromagnetic fields from the embedded microstrip line and the microstrip line on the surface can be obtained by using the electric image method for dielectric substrates. To verify the proposed approach, we conducted some experiments and compared the results of our approach with those of measurement and a commercial electromagnetic solver.
ER -