The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Penyepaduan hibrid optoelektronik ialah teknologi yang menjanjikan untuk merealisasikan komponen optik yang diperlukan dalam sistem transmisi optik, pensuisan dan interkoneksi yang menggunakan pemultipleksan pembahagian panjang gelombang (WDM) dan pemultipleksan pembahagian masa (TDM). Kami telah membangunkan modul bersepadu hibrid optik serba boleh menggunakan platform litar gelombang cahaya satah (PLC) berasaskan silika. Walau bagaimanapun, modul ini hanya terdiri daripada peranti semikonduktor optoelektronik seperti diod laser (LD) dan diod foto (PD) dan litar bersepadu optoelektronik monolitik (OEICs). Untuk menjalankan fungsi pemprosesan isyarat elektrik berkelajuan tinggi dan serba boleh dalam sistem rangkaian masa hadapan, adalah perlu untuk memasang litar bersepadu elektrik semikonduktor (IC) pada platform PLC. Dalam makalah ini, kami menerangkan teknologi baru untuk platform PLC berkelajuan tinggi yang memungkinkan untuk memasang kedua-dua IC dan peranti optoelektronik. Dengan menggunakan teknologi ini, kami mencipta modul pemancar optik bersepadu hibrid dua saluran yang disepadukan hibrid dengan cip tatasusunan LD dan IC pemacu LD. Pada platform PLC ini, kami menggunakan garis jalur mikro (MSL) untuk memacu IC pemacu LD. Kami juga mempertimbangkan kesan gangguan haba pada cip tatasusunan LD yang disebabkan oleh IC pemacu LD semasa mereka bentuk susun atur kawasan pemasangan cip. Cip tatasusunan LD dan IC pemacu LD adalah cip selak yang diikat dengan bonggol pateri bahan berbeza untuk mengelakkan sebarang kemerosotan dalam kecekapan gandingan cip tatasusunan LD. Modul pemancar optik yang kami reka beroperasi dengan jayanya pada isyarat bukan-sifar (NRZ) 9 Gbit/s. Pendekatan ini menggunakan platform PLC untuk penyepaduan hibrid cip tatasusunan LD dan IC pemacu LD akan meneruskan pembangunan modul optoelektronik berkelajuan tinggi dengan kedua-dua fungsi pemprosesan isyarat optik dan elektrik.
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Salinan
Takaharu OHYAMA, Yuji AKAHORI, Masahiro YANAGISAWA, Hideki TSUNETSUGU, Shinji MINO, "Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)" in IEICE TRANSACTIONS on Electronics,
vol. E82-C, no. 2, pp. 370-378, February 1999, doi: .
Abstract: Optoelectronic hybrid integration is a promising technology for realizing the optical components needed in optical transmission, switching, and interconnection systems that use wavelength division multiplexing (WDM) and time division multiplexing (TDM). We have already developed versatile optical hybrid integrated modules using a silica-based planar lightwave circuit (PLC) platform. However, these modules consist solely of the optoelectronic semiconductor devices such as laser diodes (LDs) and photo diodes (PDs) and monolithic optoelectronic integrated circuits (OEICs). To carry out high-speed and versatile electric signal processing functions in future network systems, it is necessary to install semiconductor electrical integrated circuits (ICs) on a PLC platform. In this paper, we describe novel technologies for high-speed PLC platforms which make it possible to assemble both ICs and optoelectronic devices. Using these technologies, we fabricated a two-channel hybrid integrated optical transmitter module which is hybrid integrated with an LD array chip and an LD driver IC. On this PLC platform, we use microstrip lines (MSLs) to drive the LD driver IC. We also considered the effect of heat interference on the LD array chip caused by the LD driver IC when designing the layout of the chip assembly region. The LD array chip and the LD driver IC were flip-chip bonded with solder bumps of a different material to avoid any deterioration in the coupling efficiency of the LD array chip. The optical transmitter module we fabricated operated successfully at 9 Gbit/s non-return-zero (NRZ) signal. This approach using a PLC platform for the hybrid integration of an LD array chip and an LD driver IC will carry forward the development of high-speed optoelectronic modules with both optical and electrical signal processing functions.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e82-c_2_370/_p
Salinan
@ARTICLE{e82-c_2_370,
author={Takaharu OHYAMA, Yuji AKAHORI, Masahiro YANAGISAWA, Hideki TSUNETSUGU, Shinji MINO, },
journal={IEICE TRANSACTIONS on Electronics},
title={Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)},
year={1999},
volume={E82-C},
number={2},
pages={370-378},
abstract={Optoelectronic hybrid integration is a promising technology for realizing the optical components needed in optical transmission, switching, and interconnection systems that use wavelength division multiplexing (WDM) and time division multiplexing (TDM). We have already developed versatile optical hybrid integrated modules using a silica-based planar lightwave circuit (PLC) platform. However, these modules consist solely of the optoelectronic semiconductor devices such as laser diodes (LDs) and photo diodes (PDs) and monolithic optoelectronic integrated circuits (OEICs). To carry out high-speed and versatile electric signal processing functions in future network systems, it is necessary to install semiconductor electrical integrated circuits (ICs) on a PLC platform. In this paper, we describe novel technologies for high-speed PLC platforms which make it possible to assemble both ICs and optoelectronic devices. Using these technologies, we fabricated a two-channel hybrid integrated optical transmitter module which is hybrid integrated with an LD array chip and an LD driver IC. On this PLC platform, we use microstrip lines (MSLs) to drive the LD driver IC. We also considered the effect of heat interference on the LD array chip caused by the LD driver IC when designing the layout of the chip assembly region. The LD array chip and the LD driver IC were flip-chip bonded with solder bumps of a different material to avoid any deterioration in the coupling efficiency of the LD array chip. The optical transmitter module we fabricated operated successfully at 9 Gbit/s non-return-zero (NRZ) signal. This approach using a PLC platform for the hybrid integration of an LD array chip and an LD driver IC will carry forward the development of high-speed optoelectronic modules with both optical and electrical signal processing functions.},
keywords={},
doi={},
ISSN={},
month={February},}
Salinan
TY - JOUR
TI - Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
T2 - IEICE TRANSACTIONS on Electronics
SP - 370
EP - 378
AU - Takaharu OHYAMA
AU - Yuji AKAHORI
AU - Masahiro YANAGISAWA
AU - Hideki TSUNETSUGU
AU - Shinji MINO
PY - 1999
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E82-C
IS - 2
JA - IEICE TRANSACTIONS on Electronics
Y1 - February 1999
AB - Optoelectronic hybrid integration is a promising technology for realizing the optical components needed in optical transmission, switching, and interconnection systems that use wavelength division multiplexing (WDM) and time division multiplexing (TDM). We have already developed versatile optical hybrid integrated modules using a silica-based planar lightwave circuit (PLC) platform. However, these modules consist solely of the optoelectronic semiconductor devices such as laser diodes (LDs) and photo diodes (PDs) and monolithic optoelectronic integrated circuits (OEICs). To carry out high-speed and versatile electric signal processing functions in future network systems, it is necessary to install semiconductor electrical integrated circuits (ICs) on a PLC platform. In this paper, we describe novel technologies for high-speed PLC platforms which make it possible to assemble both ICs and optoelectronic devices. Using these technologies, we fabricated a two-channel hybrid integrated optical transmitter module which is hybrid integrated with an LD array chip and an LD driver IC. On this PLC platform, we use microstrip lines (MSLs) to drive the LD driver IC. We also considered the effect of heat interference on the LD array chip caused by the LD driver IC when designing the layout of the chip assembly region. The LD array chip and the LD driver IC were flip-chip bonded with solder bumps of a different material to avoid any deterioration in the coupling efficiency of the LD array chip. The optical transmitter module we fabricated operated successfully at 9 Gbit/s non-return-zero (NRZ) signal. This approach using a PLC platform for the hybrid integration of an LD array chip and an LD driver IC will carry forward the development of high-speed optoelectronic modules with both optical and electrical signal processing functions.
ER -