The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Kami melaporkan tentang litar bersepadu fotonik mikromekanikal (PIC) baru untuk menyepadukan sistem optik ruang bebas pada cip. Menggunakan teknik penggilap permukaan polysilicon, elemen mikro-optik, struktur optomekanikal tiga dimensi, dan mikroaktuator disepadukan secara monolitik pada substrat silikon. Kami akan membincangkan blok binaan asas PIC mikromekanikal, termasuk pemposisi mikro XYZ, cermin mikro senget 2 paksi, kanta mikro pengimbasan, dan penyepaduan mereka dengan laser pemancar permukaan rongga menegak. Kami juga akan membincangkan aplikasi mereka dalam sambung optik boleh konfigurasi semula dan penjajaran aktif dalam sistem sambung optik ruang bebas selari.
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Salinan
Ming C. WU, Li FAN, Guo-Dong SU, "Micromechanical Photonic Integrated Circuits" in IEICE TRANSACTIONS on Electronics,
vol. E83-C, no. 6, pp. 903-911, June 2000, doi: .
Abstract: We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e83-c_6_903/_p
Salinan
@ARTICLE{e83-c_6_903,
author={Ming C. WU, Li FAN, Guo-Dong SU, },
journal={IEICE TRANSACTIONS on Electronics},
title={Micromechanical Photonic Integrated Circuits},
year={2000},
volume={E83-C},
number={6},
pages={903-911},
abstract={We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.},
keywords={},
doi={},
ISSN={},
month={June},}
Salinan
TY - JOUR
TI - Micromechanical Photonic Integrated Circuits
T2 - IEICE TRANSACTIONS on Electronics
SP - 903
EP - 911
AU - Ming C. WU
AU - Li FAN
AU - Guo-Dong SU
PY - 2000
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E83-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 2000
AB - We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.
ER -