The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Kami telah membangunkan proses penjajaran kendiri baru menggunakan tegangan permukaan resin cecair untuk pemasangan peranti elektronik atau optoelektronik. Walaupun resin cecair mempunyai ciri-ciri serendah sepersepuluh daripada tegangan permukaan pateri secara amnya, memulihkan daya untuk keupayaan penjajaran diri boleh dihasilkan dengan membuatnya dikekang pada pad 3 dimensi pada cip dan substrat. Dalam makalah ini, prinsip dan ciri-cirinya diterangkan dan hubungan antara parameter proses dan geometri sambungan telah diperiksa. Dan kemungkinan proses penjajaran diri telah disahkan oleh kaedah berangka analitik dan eksperimen berskala. Ketepatan penjajaran diri telah diperiksa secara eksperimen dan menunjukkan bahawa ia menjadi kurang daripada 0.4 µm. Ia boleh memberikan maklumat berguna tentang pelbagai parameter yang terlibat dalam geometri bersama dan garis panduan reka bentuk yang optimum untuk menjana profil yang betul.
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Salinan
Kozo FUJIMOTO, Jong-Min KIM, Shuji NAKATA, "Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices" in IEICE TRANSACTIONS on Electronics,
vol. E84-C, no. 12, pp. 1967-1974, December 2001, doi: .
Abstract: We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 µm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e84-c_12_1967/_p
Salinan
@ARTICLE{e84-c_12_1967,
author={Kozo FUJIMOTO, Jong-Min KIM, Shuji NAKATA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices},
year={2001},
volume={E84-C},
number={12},
pages={1967-1974},
abstract={We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 µm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.},
keywords={},
doi={},
ISSN={},
month={December},}
Salinan
TY - JOUR
TI - Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices
T2 - IEICE TRANSACTIONS on Electronics
SP - 1967
EP - 1974
AU - Kozo FUJIMOTO
AU - Jong-Min KIM
AU - Shuji NAKATA
PY - 2001
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E84-C
IS - 12
JA - IEICE TRANSACTIONS on Electronics
Y1 - December 2001
AB - We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 µm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.
ER -