The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Kami telah membangunkan dan menunjukkan teknik baru untuk pemeriksaan elektrik dan analisis kegagalan elektrik, yang boleh mengesan litar terbuka, rintangan tinggi dan pintas tanpa memerlukan sentuhan elektrik dengan bahagian luar cip LSI atau papan di mana cip LSI berada. dipasang. Idea asas teknik ini ialah pengesanan medan magnet yang dihasilkan oleh OBIC (arus teraruh sinar optik) atau arus foto. Magnetometer DC-SQUID (peranti gangguan kuantum superkonduktor) digunakan untuk mengesan medan magnet. Mikroskopi laser-SQUID pengimbasan ini (pendek kata "laser-SQUID") mempunyai resolusi spatial kira-kira 1.3 µm. Ia boleh digunakan untuk membezakan cip yang rosak sebelum mencorakkan pad ikatan atau selepas ikatan tanpa pemilihan pin. Ia boleh menyetempatkan mana-mana tapak yang rosak dalam cip ke dalam beberapa mikron persegi.
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Salinan
Kiyoshi NIKAWA, "Laser-SQUID Microscopy as a Novel Tool for Inspection, Monitoring and Analysis of LSI-Chip-Defects: Nondestructive and Non-electrical-contact Technique" in IEICE TRANSACTIONS on Electronics,
vol. E85-C, no. 3, pp. 746-751, March 2002, doi: .
Abstract: We have developed and demonstrated a novel technique for electrical inspection and electrical failure analysis, which can detect open, high-resistance, and short circuits without the need for electrical contact with the outside of the LSI chip or the board on which the LSI chip is mounted. The basic idea of the technique is the detection of the magnetic field produced by OBIC (optical beam induced current) or photo current. A DC-SQUID (superconducting quantum interference device) magnetometer is used to detect the magnetic field. This scanning laser-SQUID microscopy ("laser-SQUID" for short) has a spatial resolution of about 1.3 µm. It can be used to distinguish defective chips before bonding pad patterning or after bonding without pin-selection. It can localize any defective site in the chip to within a few square microns.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e85-c_3_746/_p
Salinan
@ARTICLE{e85-c_3_746,
author={Kiyoshi NIKAWA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Laser-SQUID Microscopy as a Novel Tool for Inspection, Monitoring and Analysis of LSI-Chip-Defects: Nondestructive and Non-electrical-contact Technique},
year={2002},
volume={E85-C},
number={3},
pages={746-751},
abstract={We have developed and demonstrated a novel technique for electrical inspection and electrical failure analysis, which can detect open, high-resistance, and short circuits without the need for electrical contact with the outside of the LSI chip or the board on which the LSI chip is mounted. The basic idea of the technique is the detection of the magnetic field produced by OBIC (optical beam induced current) or photo current. A DC-SQUID (superconducting quantum interference device) magnetometer is used to detect the magnetic field. This scanning laser-SQUID microscopy ("laser-SQUID" for short) has a spatial resolution of about 1.3 µm. It can be used to distinguish defective chips before bonding pad patterning or after bonding without pin-selection. It can localize any defective site in the chip to within a few square microns.},
keywords={},
doi={},
ISSN={},
month={March},}
Salinan
TY - JOUR
TI - Laser-SQUID Microscopy as a Novel Tool for Inspection, Monitoring and Analysis of LSI-Chip-Defects: Nondestructive and Non-electrical-contact Technique
T2 - IEICE TRANSACTIONS on Electronics
SP - 746
EP - 751
AU - Kiyoshi NIKAWA
PY - 2002
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E85-C
IS - 3
JA - IEICE TRANSACTIONS on Electronics
Y1 - March 2002
AB - We have developed and demonstrated a novel technique for electrical inspection and electrical failure analysis, which can detect open, high-resistance, and short circuits without the need for electrical contact with the outside of the LSI chip or the board on which the LSI chip is mounted. The basic idea of the technique is the detection of the magnetic field produced by OBIC (optical beam induced current) or photo current. A DC-SQUID (superconducting quantum interference device) magnetometer is used to detect the magnetic field. This scanning laser-SQUID microscopy ("laser-SQUID" for short) has a spatial resolution of about 1.3 µm. It can be used to distinguish defective chips before bonding pad patterning or after bonding without pin-selection. It can localize any defective site in the chip to within a few square microns.
ER -