The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
pandangan teks lengkap
94
Kami melaporkan kemajuan terbaru kami dalam teknologi peranti bersepadu fotonik silikon yang menyasarkan aplikasi sambung optik berkapasiti besar pada peringkat cip. Untuk merealisasikan penghantaran data berkapasiti tinggi, kami berjaya membangunkan transceiver bersepadu fotonik silikon jenis pada pakej dan menunjukkan operasi serentak 400 Gbps. 56 Gbps nadi-amplitud-modulasi (PAM) 4 dan teknologi pembahagian-pembilangan panjang gelombang juga diperkenalkan untuk meningkatkan kapasiti penghantaran.
Yu TANAKA
Photonics Electronics Technology Research Association (PETRA),Fujitsu Laboratories Limited,Fujitsu Limited
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Salinan
Yu TANAKA, "Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers" in IEICE TRANSACTIONS on Electronics,
vol. E102-C, no. 4, pp. 357-363, April 2019, doi: 10.1587/transele.2018ODI0007.
Abstract: We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2018ODI0007/_p
Salinan
@ARTICLE{e102-c_4_357,
author={Yu TANAKA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers},
year={2019},
volume={E102-C},
number={4},
pages={357-363},
abstract={We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.},
keywords={},
doi={10.1587/transele.2018ODI0007},
ISSN={1745-1353},
month={April},}
Salinan
TY - JOUR
TI - Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers
T2 - IEICE TRANSACTIONS on Electronics
SP - 357
EP - 363
AU - Yu TANAKA
PY - 2019
DO - 10.1587/transele.2018ODI0007
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E102-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 2019
AB - We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.
ER -