The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Penyaduran tanpa elektro kuprum (Cu) telah dijalankan pada substrat polydimethylsiloxane (PDMS) planar dan berstruktur mikro. Dalam kajian ini, filem nipis organik yang ditamatkan dengan kumpulan yang mengandungi nitrogen (N), cth berus poli (dimethylaminoethyl methacrylate) (PDMAEMA), aminopropyl trimethoxysilane monolayer (APTES), dan polydopamine (PDA) digunakan untuk menambat pemangkin paladium (Pd). Walaupun penyaduran tanpa elektrik berjaya dipromosikan pada semua permukaan sampel, PDMAEMA didapati mencapai kekuatan lekatan terbaik pada permukaan PDMS, berbanding substrat PDMS yang dilindungi APTES dan PDA, disebabkan oleh ikatan kovalen, kesan penambat rantai polimer serta tinggi. pertalian atom N dengan spesies Pd. Proses kami juga berjaya digunakan pada penyaduran tanpa elektro substrat PDMS berstruktur mikro.
Tomoya SATO
AIST
Narendra SINGH
AIST
Roland HÖNES
AIST
Chihiro URATA
AIST
Yasutaka MATSUO
Hokkaido University
Atsushi HOZUMI
AIST
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Salinan
Tomoya SATO, Narendra SINGH, Roland HÖNES, Chihiro URATA, Yasutaka MATSUO, Atsushi HOZUMI, "Organic Thin Film-Assisted Copper Electroless Plating on Flat/Microstructured Silicone Substrates" in IEICE TRANSACTIONS on Electronics,
vol. E102-C, no. 2, pp. 147-150, February 2019, doi: 10.1587/transele.2018OMS0004.
Abstract: Copper (Cu) electroless plating was conducted on planar and microstructured polydimethylsiloxane (PDMS) substrates. In this study, organic thin films terminated with nitrogen (N)-containing groups, e.g. poly (dimethylaminoethyl methacrylate) brush (PDMAEMA), aminopropyl trimethoxysilane monolayer (APTES), and polydopamine (PDA) were used to anchor palladium (Pd) catalyst. While electroless plating was successfully promoted on all sample surfaces, PDMAEMA was found to achieve the best adhesion strength to the PDMS surfaces, compared to APTES- and PDA-covered PDMS substrates, due to covalent bonding, anchoring effects of polymer chains as well as high affinity of N atoms to Pd species. Our process was also successfully applied to the electroless plating of microstructured PDMS substrates.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2018OMS0004/_p
Salinan
@ARTICLE{e102-c_2_147,
author={Tomoya SATO, Narendra SINGH, Roland HÖNES, Chihiro URATA, Yasutaka MATSUO, Atsushi HOZUMI, },
journal={IEICE TRANSACTIONS on Electronics},
title={Organic Thin Film-Assisted Copper Electroless Plating on Flat/Microstructured Silicone Substrates},
year={2019},
volume={E102-C},
number={2},
pages={147-150},
abstract={Copper (Cu) electroless plating was conducted on planar and microstructured polydimethylsiloxane (PDMS) substrates. In this study, organic thin films terminated with nitrogen (N)-containing groups, e.g. poly (dimethylaminoethyl methacrylate) brush (PDMAEMA), aminopropyl trimethoxysilane monolayer (APTES), and polydopamine (PDA) were used to anchor palladium (Pd) catalyst. While electroless plating was successfully promoted on all sample surfaces, PDMAEMA was found to achieve the best adhesion strength to the PDMS surfaces, compared to APTES- and PDA-covered PDMS substrates, due to covalent bonding, anchoring effects of polymer chains as well as high affinity of N atoms to Pd species. Our process was also successfully applied to the electroless plating of microstructured PDMS substrates.},
keywords={},
doi={10.1587/transele.2018OMS0004},
ISSN={1745-1353},
month={February},}
Salinan
TY - JOUR
TI - Organic Thin Film-Assisted Copper Electroless Plating on Flat/Microstructured Silicone Substrates
T2 - IEICE TRANSACTIONS on Electronics
SP - 147
EP - 150
AU - Tomoya SATO
AU - Narendra SINGH
AU - Roland HÖNES
AU - Chihiro URATA
AU - Yasutaka MATSUO
AU - Atsushi HOZUMI
PY - 2019
DO - 10.1587/transele.2018OMS0004
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E102-C
IS - 2
JA - IEICE TRANSACTIONS on Electronics
Y1 - February 2019
AB - Copper (Cu) electroless plating was conducted on planar and microstructured polydimethylsiloxane (PDMS) substrates. In this study, organic thin films terminated with nitrogen (N)-containing groups, e.g. poly (dimethylaminoethyl methacrylate) brush (PDMAEMA), aminopropyl trimethoxysilane monolayer (APTES), and polydopamine (PDA) were used to anchor palladium (Pd) catalyst. While electroless plating was successfully promoted on all sample surfaces, PDMAEMA was found to achieve the best adhesion strength to the PDMS surfaces, compared to APTES- and PDA-covered PDMS substrates, due to covalent bonding, anchoring effects of polymer chains as well as high affinity of N atoms to Pd species. Our process was also successfully applied to the electroless plating of microstructured PDMS substrates.
ER -