The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Timah dan aloinya telah digunakan untuk penyaduran sesentuh elektrik untuk keadaan kuasa elektrik yang rendah. Khususnya, kenalan bersalut timah digunakan secara meluas sebagai kenalan penyambung dalam aplikasi automotif dan sebagai kenalan make-break dalam suis papan kekunci. Dalam hubungan antara rintangan sentuhan (R) dan beban sentuhan (W) untuk kedua-dua pepejal dan timah bersalut, singulariti telah ditemui. Teori-teori yang telah ditubuhkan dan terkenal mengenai ubah bentuk antara muka kenalan tidak dapat menjelaskan singulariti ini. Dalam kajian ini, untuk menjelaskan singulariti ini, dan untuk mendapatkan model hubungan yang menerangkan fenomena ini, jejak kenalan untuk beban sentuhan telah diperiksa oleh SEM dan STM. Imej mikroskopik yang diperolehi menunjukkan timbunan di pinggir kawasan sentuhan untuk timah pepejal dan bersalut. Dalam kes ini, konfigurasi sentuhan terdiri daripada kuar platinum dengan permukaan hujung hemisfera dan permukaan timah rata untuk kedua-dua pepejal dan bersalut. Apabila probe dimuatkan, hujung probe ini tenggelam ke dalam permukaan timah lembut kerana kekerasannya yang lebih rendah. Dalam kes timah pepejal, tenggelamnya permukaan kuar ke dalam permukaan timah menyebabkan timbunan di sekeliling pinggir kesan sentuhan. Dalam proses ubah bentuk ini, oleh kerana pinggiran lekukan kawasan sesentuh yang disentuh tergelincir teruk terhadap permukaan kuar platinum semasa menggunakan beban sesentuh, rintangan sesentuh berkurangan dengan cepat dengan beban. Dalam kes ini, bahagian tengah kawasan sentuhan sebenar tidak terjejas secara mekanikal; oleh itu, filem permukaan pada bahagian bawah permukaan rata yang cacat tidak pecah secara mekanikal. Sebaliknya, dalam kes permukaan bersalut timah, longgokan serupa berlaku; walau bagaimanapun, ia disertai dengan penyebaran dan pemisahan butiran kristal timah dari permukaan. Hasil daripada proses ini, penurunan rintangan sentuhan yang serupa dengan timah pepejal berlaku. Memandangkan timbunan permukaan sentuhan adalah proses yang sangat penting dalam penggunaan penyambung, ciri-ciri luar biasa yang disebutkan di atas telah dijelaskan dalam kajian ini.
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Salinan
Terutaka TAMAI, Shigeru SAWADA, Yasuhiro HATTORI, "Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors" in IEICE TRANSACTIONS on Electronics,
vol. E93-C, no. 5, pp. 670-677, May 2010, doi: 10.1587/transele.E93.C.670.
Abstract: Tin and its alloys have been applied for the plating of electrical contacts for low electrical power conditions. In particular, tin-plated contacts are widely used as connector contacts in automotive applications and as make-break contacts in keyboard switches. In the relationship between contact resistance (R) and contact load (W) for both solid and plated tin, singularities have been found. Previously established and well known theories on the deformation of contact interfaces cannot explain these singularities. In this study, to clarify these singularities, and to obtain a contact model explaining this phenomenon, contact traces for contact load were examined by SEM and STM. The obtained microscopic images indicated piling-up at the periphery of the contact area for both solid and plated tin. In this case the contact configuration comprised a platinum probe with a hemispherical tip surface and a flat tin surface for both solid and plated. When the probe was loaded, this tip of the probe sank into the soft tin surface owing to its lower hardness. In case of solid tin, the sinking of the probe surface into the tin surface causes piling-up around the periphery of the contact trace. In this deformation process, since the periphery of the indentation of the indented contact area severely slid against the surface of the platinum probe while applying a contact load, the contact resistance rapidly decreased with load. In this case, the center portion of the true contact area was not affected mechanically; thus, the surface film on the bottom portion of the deformed of the flat surface did not break down mechanically. On the other hand, in the case of a tin plated surface, similar piling up occurred; however, it was accompanied by scattering and separation of tin crystal grains from the surface. As a result of this process, a decrease in contact resistance similar to that for the solid tin occurred. Since the piling-up of the contact surface is a very important process in the application of connectors, the above-mentioned unusual characteristics were clarified in this study.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.E93.C.670/_p
Salinan
@ARTICLE{e93-c_5_670,
author={Terutaka TAMAI, Shigeru SAWADA, Yasuhiro HATTORI, },
journal={IEICE TRANSACTIONS on Electronics},
title={Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors},
year={2010},
volume={E93-C},
number={5},
pages={670-677},
abstract={Tin and its alloys have been applied for the plating of electrical contacts for low electrical power conditions. In particular, tin-plated contacts are widely used as connector contacts in automotive applications and as make-break contacts in keyboard switches. In the relationship between contact resistance (R) and contact load (W) for both solid and plated tin, singularities have been found. Previously established and well known theories on the deformation of contact interfaces cannot explain these singularities. In this study, to clarify these singularities, and to obtain a contact model explaining this phenomenon, contact traces for contact load were examined by SEM and STM. The obtained microscopic images indicated piling-up at the periphery of the contact area for both solid and plated tin. In this case the contact configuration comprised a platinum probe with a hemispherical tip surface and a flat tin surface for both solid and plated. When the probe was loaded, this tip of the probe sank into the soft tin surface owing to its lower hardness. In case of solid tin, the sinking of the probe surface into the tin surface causes piling-up around the periphery of the contact trace. In this deformation process, since the periphery of the indentation of the indented contact area severely slid against the surface of the platinum probe while applying a contact load, the contact resistance rapidly decreased with load. In this case, the center portion of the true contact area was not affected mechanically; thus, the surface film on the bottom portion of the deformed of the flat surface did not break down mechanically. On the other hand, in the case of a tin plated surface, similar piling up occurred; however, it was accompanied by scattering and separation of tin crystal grains from the surface. As a result of this process, a decrease in contact resistance similar to that for the solid tin occurred. Since the piling-up of the contact surface is a very important process in the application of connectors, the above-mentioned unusual characteristics were clarified in this study.},
keywords={},
doi={10.1587/transele.E93.C.670},
ISSN={1745-1353},
month={May},}
Salinan
TY - JOUR
TI - Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors
T2 - IEICE TRANSACTIONS on Electronics
SP - 670
EP - 677
AU - Terutaka TAMAI
AU - Shigeru SAWADA
AU - Yasuhiro HATTORI
PY - 2010
DO - 10.1587/transele.E93.C.670
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E93-C
IS - 5
JA - IEICE TRANSACTIONS on Electronics
Y1 - May 2010
AB - Tin and its alloys have been applied for the plating of electrical contacts for low electrical power conditions. In particular, tin-plated contacts are widely used as connector contacts in automotive applications and as make-break contacts in keyboard switches. In the relationship between contact resistance (R) and contact load (W) for both solid and plated tin, singularities have been found. Previously established and well known theories on the deformation of contact interfaces cannot explain these singularities. In this study, to clarify these singularities, and to obtain a contact model explaining this phenomenon, contact traces for contact load were examined by SEM and STM. The obtained microscopic images indicated piling-up at the periphery of the contact area for both solid and plated tin. In this case the contact configuration comprised a platinum probe with a hemispherical tip surface and a flat tin surface for both solid and plated. When the probe was loaded, this tip of the probe sank into the soft tin surface owing to its lower hardness. In case of solid tin, the sinking of the probe surface into the tin surface causes piling-up around the periphery of the contact trace. In this deformation process, since the periphery of the indentation of the indented contact area severely slid against the surface of the platinum probe while applying a contact load, the contact resistance rapidly decreased with load. In this case, the center portion of the true contact area was not affected mechanically; thus, the surface film on the bottom portion of the deformed of the flat surface did not break down mechanically. On the other hand, in the case of a tin plated surface, similar piling up occurred; however, it was accompanied by scattering and separation of tin crystal grains from the surface. As a result of this process, a decrease in contact resistance similar to that for the solid tin occurred. Since the piling-up of the contact surface is a very important process in the application of connectors, the above-mentioned unusual characteristics were clarified in this study.
ER -