The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Pembahagi kuasa 3D jenis baharu berdasarkan rongga bulat bersepadu substrat separuh mod (HSICC) dicadangkan. Pembahagi kuasa baru ini boleh mengurangkan saiz pembahagi kuasa berdasarkan rongga bulat bersepadu substrat biasa (SICC) sebanyak hampir separuh. Untuk mengesahkan kesahihan kaedah reka bentuk, pembahagi kuasa HSICC dua hala X-band menggunakan teknologi seramik pembakaran bersama suhu rendah (LTCC) direka, direka dan diukur.
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Salinan
Jian GU, Yong FAN, Haiyan JIN, "A Novel 3D Power Divider Based on Half-Mode Substrate Integrated Circular Cavity" in IEICE TRANSACTIONS on Electronics,
vol. E94-C, no. 3, pp. 379-382, March 2011, doi: 10.1587/transele.E94.C.379.
Abstract: A new kind of 3D power divider based on a half-mode substrate integrated circular cavity (HSICC) is proposed. This novel power divider can reduce the size of a power divider based on normal substrate integrated circular cavity (SICC) by nearly a half. To verify the validity of the design method, a two-way X-band HSICC power divider using low temperature co-fired ceramic (LTCC) technology is designed, fabricated and measured.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.E94.C.379/_p
Salinan
@ARTICLE{e94-c_3_379,
author={Jian GU, Yong FAN, Haiyan JIN, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Novel 3D Power Divider Based on Half-Mode Substrate Integrated Circular Cavity},
year={2011},
volume={E94-C},
number={3},
pages={379-382},
abstract={A new kind of 3D power divider based on a half-mode substrate integrated circular cavity (HSICC) is proposed. This novel power divider can reduce the size of a power divider based on normal substrate integrated circular cavity (SICC) by nearly a half. To verify the validity of the design method, a two-way X-band HSICC power divider using low temperature co-fired ceramic (LTCC) technology is designed, fabricated and measured.},
keywords={},
doi={10.1587/transele.E94.C.379},
ISSN={1745-1353},
month={March},}
Salinan
TY - JOUR
TI - A Novel 3D Power Divider Based on Half-Mode Substrate Integrated Circular Cavity
T2 - IEICE TRANSACTIONS on Electronics
SP - 379
EP - 382
AU - Jian GU
AU - Yong FAN
AU - Haiyan JIN
PY - 2011
DO - 10.1587/transele.E94.C.379
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E94-C
IS - 3
JA - IEICE TRANSACTIONS on Electronics
Y1 - March 2011
AB - A new kind of 3D power divider based on a half-mode substrate integrated circular cavity (HSICC) is proposed. This novel power divider can reduce the size of a power divider based on normal substrate integrated circular cavity (SICC) by nearly a half. To verify the validity of the design method, a two-way X-band HSICC power divider using low temperature co-fired ceramic (LTCC) technology is designed, fabricated and measured.
ER -