The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
pandangan teks lengkap
86
Hari ini, produk semikonduktor praktikal adalah sebahagian daripada kehidupan kita dan infrastruktur masyarakat, dan trend ini akan berterusan pada masa hadapan. Bidang permohonan baharu akan berkembang ke dalam bidang berkaitan perubatan, alam sekitar dan pertanian (makanan) di samping bidang berkaitan teknologi maklumat dan komunikasi (ICT) konvensional. Peranti semikonduktor kos rendah dengan fungsi canggih setakat ini telah direalisasikan oleh pengecilan. Walau bagaimanapun, kami kini menghampiri had fizikal pengecilan, dan juga, pelaburan yang diperlukan untuk kemudahan pembuatan semikonduktor baharu telah menjadi besar. Dalam keadaan sedemikian, kami mencadangkan pendekatan berdasarkan peranti semikonduktor yang dipanggil cip mikrokube dan idea pembangunan semikonduktor, iaitu, penyepaduan tangkas dan "inci-fab." Pendekatan kami dijangka menyumbang kepada meluaskan rangkaian syarikat yang boleh mengarang peranti semikonduktor untuk memasukkan syarikat bersaiz kecil, meneroka aplikasi baharu peranti semikonduktor dan menyediakan pelbagai jenis peranti semikonduktor pada kos rendah daripada industri semikonduktor.
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Salinan
Koji KAI, Minoru FUJISHIMA, "Prospective Silicon Applications and Technologies in 2025" in IEICE TRANSACTIONS on Electronics,
vol. E94-C, no. 4, pp. 386-393, April 2011, doi: 10.1587/transele.E94.C.386.
Abstract: Today, practical semiconductor products are an integral part of our lives and the infrastructure of society, and this trend will continue in the future. New areas of application will expand into medical, environmental, and agriculture (food)-related fields in addition to the conventional information and communication technology (ICT)-related field. Low-cost semiconductor devices with advanced functions have thus far been realized by miniaturization. However, we are now approaching the physical limit of miniaturization, and also, the investment required for new semiconductor manufacturing facilities has become huge. Under such circumstances, we propose an approach based on semiconductor devices called microcube chips and ideas of semiconductor development, i.e., agile integration and "inch-fab." Our approach is expected to contribute to expanding the range of companies that can fabricate semiconductor devices to include small-size companies, exploring new applications of semiconductor devices, and providing a wide variety of semiconductor devices at a low cost from the semiconductor industry.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.E94.C.386/_p
Salinan
@ARTICLE{e94-c_4_386,
author={Koji KAI, Minoru FUJISHIMA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Prospective Silicon Applications and Technologies in 2025},
year={2011},
volume={E94-C},
number={4},
pages={386-393},
abstract={Today, practical semiconductor products are an integral part of our lives and the infrastructure of society, and this trend will continue in the future. New areas of application will expand into medical, environmental, and agriculture (food)-related fields in addition to the conventional information and communication technology (ICT)-related field. Low-cost semiconductor devices with advanced functions have thus far been realized by miniaturization. However, we are now approaching the physical limit of miniaturization, and also, the investment required for new semiconductor manufacturing facilities has become huge. Under such circumstances, we propose an approach based on semiconductor devices called microcube chips and ideas of semiconductor development, i.e., agile integration and "inch-fab." Our approach is expected to contribute to expanding the range of companies that can fabricate semiconductor devices to include small-size companies, exploring new applications of semiconductor devices, and providing a wide variety of semiconductor devices at a low cost from the semiconductor industry.},
keywords={},
doi={10.1587/transele.E94.C.386},
ISSN={1745-1353},
month={April},}
Salinan
TY - JOUR
TI - Prospective Silicon Applications and Technologies in 2025
T2 - IEICE TRANSACTIONS on Electronics
SP - 386
EP - 393
AU - Koji KAI
AU - Minoru FUJISHIMA
PY - 2011
DO - 10.1587/transele.E94.C.386
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E94-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 2011
AB - Today, practical semiconductor products are an integral part of our lives and the infrastructure of society, and this trend will continue in the future. New areas of application will expand into medical, environmental, and agriculture (food)-related fields in addition to the conventional information and communication technology (ICT)-related field. Low-cost semiconductor devices with advanced functions have thus far been realized by miniaturization. However, we are now approaching the physical limit of miniaturization, and also, the investment required for new semiconductor manufacturing facilities has become huge. Under such circumstances, we propose an approach based on semiconductor devices called microcube chips and ideas of semiconductor development, i.e., agile integration and "inch-fab." Our approach is expected to contribute to expanding the range of companies that can fabricate semiconductor devices to include small-size companies, exploring new applications of semiconductor devices, and providing a wide variety of semiconductor devices at a low cost from the semiconductor industry.
ER -