The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Pemeriksaan visual papan litar bercetak (PCB) pada peringkat pengeluaran akhir adalah perlu untuk jaminan kualiti dan keperluan untuk sistem pemeriksaan automatik adalah sangat tinggi. Walau bagaimanapun, pemeriksaan corak yang konsisten pada PCB ini adalah sangat sukar kerana kerumitan corak. Kebanyakan teknik yang dibangunkan sebelum ini tidak cukup sensitif untuk mengesan kecacatan dalam corak yang kompleks. Untuk menyelesaikan masalah ini, kami mencadangkan sistem optik baharu yang mendiskriminasi jenis corak yang sedia ada pada PCB, seperti tembaga, rintangan pateri dan percetakan skrin sutera. Kami juga telah membangunkan teknik pengesanan kecacatan hibrid untuk memeriksa corak yang didiskriminasi. Teknik ini adalah berdasarkan ukuran bentuk dan kaedah pengekstrakan ciri. Kami menggunakan teknik yang dicadangkan dalam sistem pemeriksaan automatik sebenar, merealisasikan transaksi masa nyata dengan gabungan perkakasan yang dilengkapi dengan LSI pemprosesan imej dan perisian PC. Penilaian dengan sistem pemeriksaan ini memastikan kadar pengesanan kecacatan 100% dan kadar penggera palsu yang agak rendah (0.06%). Kertas kerja ini menerangkan algoritma pemeriksaan dan menerangkan secara ringkas sistem pemeriksaan automatik.
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Salinan
Hilario Haruomi KOBAYASHI, Yasuhiko HARA, Hideaki DOI, Kazuo TAKAI, Akiyoshi SUMIYA, "Hybrid Defect Detection Method Based on the Shape Measurement and Feature Extraction for Complex Patterns" in IEICE TRANSACTIONS on Information,
vol. E83-D, no. 7, pp. 1338-1345, July 2000, doi: .
Abstract: The visual inspection of printed circuit boards (PCBs) at the final production stage is necessary for quality assurance and the requirements for an automated inspection system are very high. However, consistent inspection of patterns on these PCBs is very difficult due to pattern complexity. Most of the previously developed techniques are not sensitive enough to detect defects in complex patterns. To solve this problem, we propose a new optical system that discriminates pattern types existing on a PCB, such as copper, solder resist and silk-screen printing. We have also developed a hybrid defect detection technique to inspect discriminated patterns. This technique is based on shape measurement and features extraction methods. We used the proposed techniques in an actual automated inspection system, realizing real time transactions with a combination of hardware equipped with image processing LSIs and PC software. Evaluation with this inspection system ensures a 100% defect detection rate and a fairly low false alarm rate (0.06%). The present paper describes the inspection algorithm and briefly explains the automated inspection system.
URL: https://global.ieice.org/en_transactions/information/10.1587/e83-d_7_1338/_p
Salinan
@ARTICLE{e83-d_7_1338,
author={Hilario Haruomi KOBAYASHI, Yasuhiko HARA, Hideaki DOI, Kazuo TAKAI, Akiyoshi SUMIYA, },
journal={IEICE TRANSACTIONS on Information},
title={Hybrid Defect Detection Method Based on the Shape Measurement and Feature Extraction for Complex Patterns},
year={2000},
volume={E83-D},
number={7},
pages={1338-1345},
abstract={The visual inspection of printed circuit boards (PCBs) at the final production stage is necessary for quality assurance and the requirements for an automated inspection system are very high. However, consistent inspection of patterns on these PCBs is very difficult due to pattern complexity. Most of the previously developed techniques are not sensitive enough to detect defects in complex patterns. To solve this problem, we propose a new optical system that discriminates pattern types existing on a PCB, such as copper, solder resist and silk-screen printing. We have also developed a hybrid defect detection technique to inspect discriminated patterns. This technique is based on shape measurement and features extraction methods. We used the proposed techniques in an actual automated inspection system, realizing real time transactions with a combination of hardware equipped with image processing LSIs and PC software. Evaluation with this inspection system ensures a 100% defect detection rate and a fairly low false alarm rate (0.06%). The present paper describes the inspection algorithm and briefly explains the automated inspection system.},
keywords={},
doi={},
ISSN={},
month={July},}
Salinan
TY - JOUR
TI - Hybrid Defect Detection Method Based on the Shape Measurement and Feature Extraction for Complex Patterns
T2 - IEICE TRANSACTIONS on Information
SP - 1338
EP - 1345
AU - Hilario Haruomi KOBAYASHI
AU - Yasuhiko HARA
AU - Hideaki DOI
AU - Kazuo TAKAI
AU - Akiyoshi SUMIYA
PY - 2000
DO -
JO - IEICE TRANSACTIONS on Information
SN -
VL - E83-D
IS - 7
JA - IEICE TRANSACTIONS on Information
Y1 - July 2000
AB - The visual inspection of printed circuit boards (PCBs) at the final production stage is necessary for quality assurance and the requirements for an automated inspection system are very high. However, consistent inspection of patterns on these PCBs is very difficult due to pattern complexity. Most of the previously developed techniques are not sensitive enough to detect defects in complex patterns. To solve this problem, we propose a new optical system that discriminates pattern types existing on a PCB, such as copper, solder resist and silk-screen printing. We have also developed a hybrid defect detection technique to inspect discriminated patterns. This technique is based on shape measurement and features extraction methods. We used the proposed techniques in an actual automated inspection system, realizing real time transactions with a combination of hardware equipped with image processing LSIs and PC software. Evaluation with this inspection system ensures a 100% defect detection rate and a fairly low false alarm rate (0.06%). The present paper describes the inspection algorithm and briefly explains the automated inspection system.
ER -