The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
CC-Link yang dicadangkan oleh Syarikat Mitsubishi Electric ialah rangkaian industri yang digunakan secara eksklusif dalam kebanyakan industri. Walau bagaimanapun, kebarangkalian kehilangan data dan gangguan terhadap kawalan peralatan meningkat jika masa penghantaran lebih besar daripada masa imbasan pautan 381µs. Masa imbasan pautan boleh dikurangkan dengan mereka bentuk modul CC-Link sebagai antara muka mikropemproses luaran (MPU) R-IN32M3; namun, ia kemudiannya mengalami masalah kebolehkembangan. Oleh itu, dalam kertas ini, kami mencadangkan modul CC-Link baharu menggunakan R-IN32M3 untuk meningkatkan kebolehkembangan. Dalam modul CC-Link kami yang direka bentuk, kami merangka fungsi RAM dwi-port (DPRAM) dalam modul I/O luaran, yang membolehkan komunikasi selari antara DPRAM dan MPU luaran. Percubaan kami dengan prototaip CC-Link yang dilaksanakan menunjukkan bahawa reka bentuk CC-Link kami meningkatkan kelajuan komunikasi disebabkan komunikasi selari antara DPRAM dan MPU luaran, dan kebolehkembangan I/O jauh. Reka bentuk kami mencapai pengecilan modul CC-Link, pengurangan pendawaian dan pengurangan kira-kira 30% dalam masa imbasan pautan. Tambahan pula, kerana kami menggunakan kedua-dua cip Renesas R-IN32M3 dan Xilinx XC95144XL digunakan secara meluas dalam pelbagai bidang aplikasi, modul CC-Link yang direka bentuk mengurangkan kos pelaburan. Reka bentuk yang dicadangkan dijangka menyumbang dengan ketara kepada penggunaan memori pengawal logik boleh atur cara dan pengembangan I/O untuk automasi kilang dan peningkatan kecekapan pelaburan dalam industri paparan panel rata.
Yeong-Mo YEON
METIS,Korea University of Technology and Education
Seung-Hee KIM
Korea University of Technology and Education
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Salinan
Yeong-Mo YEON, Seung-Hee KIM, "Design of High-Speed Easy-to-Expand CC-Link Parallel Communication Module Based on R-IN32M3" in IEICE TRANSACTIONS on Information,
vol. E102-D, no. 1, pp. 116-123, January 2019, doi: 10.1587/transinf.2018EDP7101.
Abstract: The CC-Link proposed by the Mitsubishi Electric Company is an industrial network used exclusively in most industries. However, the probabilities of data loss and interference with equipment control increase if the transmission time is greater than the link scan time of 381µs. The link scan time can be reduced by designing the CC-Link module as an external microprocessor (MPU) interface of R-IN32M3; however, it then suffers from expandability issues. Thus, in this paper, we propose a new CC-Link module utilizing R-IN32M3 to improve the expandability. In our designed CC-Link module, we devise a dual-port RAM (DPRAM) function in an external I/O module, which enables parallel communication between the DPRAM and the external MPU. Our experiment with the implemented CC-Link prototype demonstrates that our CC-Link design improves the communication speed owing to the parallel communication between DPRAM and external MPU, and expandability of remote I/O. Our design achieves miniaturization of the CC-Link module, wiring reduction, and an approximately 30% reduction in the link scan time. Furthermore, because we utilize both the Renesas R-IN32M3 and Xilinx XC95144XL chips widely used in diverse application areas, the designed CC-Link module reduces the investment cost. The proposed design is expected to significantly contribute to the utilization of the programmable logic controller memory and I/O expansion for factory automation and improvement of the investment efficiency in the flat panel display industry.
URL: https://global.ieice.org/en_transactions/information/10.1587/transinf.2018EDP7101/_p
Salinan
@ARTICLE{e102-d_1_116,
author={Yeong-Mo YEON, Seung-Hee KIM, },
journal={IEICE TRANSACTIONS on Information},
title={Design of High-Speed Easy-to-Expand CC-Link Parallel Communication Module Based on R-IN32M3},
year={2019},
volume={E102-D},
number={1},
pages={116-123},
abstract={The CC-Link proposed by the Mitsubishi Electric Company is an industrial network used exclusively in most industries. However, the probabilities of data loss and interference with equipment control increase if the transmission time is greater than the link scan time of 381µs. The link scan time can be reduced by designing the CC-Link module as an external microprocessor (MPU) interface of R-IN32M3; however, it then suffers from expandability issues. Thus, in this paper, we propose a new CC-Link module utilizing R-IN32M3 to improve the expandability. In our designed CC-Link module, we devise a dual-port RAM (DPRAM) function in an external I/O module, which enables parallel communication between the DPRAM and the external MPU. Our experiment with the implemented CC-Link prototype demonstrates that our CC-Link design improves the communication speed owing to the parallel communication between DPRAM and external MPU, and expandability of remote I/O. Our design achieves miniaturization of the CC-Link module, wiring reduction, and an approximately 30% reduction in the link scan time. Furthermore, because we utilize both the Renesas R-IN32M3 and Xilinx XC95144XL chips widely used in diverse application areas, the designed CC-Link module reduces the investment cost. The proposed design is expected to significantly contribute to the utilization of the programmable logic controller memory and I/O expansion for factory automation and improvement of the investment efficiency in the flat panel display industry.},
keywords={},
doi={10.1587/transinf.2018EDP7101},
ISSN={1745-1361},
month={January},}
Salinan
TY - JOUR
TI - Design of High-Speed Easy-to-Expand CC-Link Parallel Communication Module Based on R-IN32M3
T2 - IEICE TRANSACTIONS on Information
SP - 116
EP - 123
AU - Yeong-Mo YEON
AU - Seung-Hee KIM
PY - 2019
DO - 10.1587/transinf.2018EDP7101
JO - IEICE TRANSACTIONS on Information
SN - 1745-1361
VL - E102-D
IS - 1
JA - IEICE TRANSACTIONS on Information
Y1 - January 2019
AB - The CC-Link proposed by the Mitsubishi Electric Company is an industrial network used exclusively in most industries. However, the probabilities of data loss and interference with equipment control increase if the transmission time is greater than the link scan time of 381µs. The link scan time can be reduced by designing the CC-Link module as an external microprocessor (MPU) interface of R-IN32M3; however, it then suffers from expandability issues. Thus, in this paper, we propose a new CC-Link module utilizing R-IN32M3 to improve the expandability. In our designed CC-Link module, we devise a dual-port RAM (DPRAM) function in an external I/O module, which enables parallel communication between the DPRAM and the external MPU. Our experiment with the implemented CC-Link prototype demonstrates that our CC-Link design improves the communication speed owing to the parallel communication between DPRAM and external MPU, and expandability of remote I/O. Our design achieves miniaturization of the CC-Link module, wiring reduction, and an approximately 30% reduction in the link scan time. Furthermore, because we utilize both the Renesas R-IN32M3 and Xilinx XC95144XL chips widely used in diverse application areas, the designed CC-Link module reduces the investment cost. The proposed design is expected to significantly contribute to the utilization of the programmable logic controller memory and I/O expansion for factory automation and improvement of the investment efficiency in the flat panel display industry.
ER -